Thermal compound improves heat dissipation

Thermal compound improves heat dissipation

New Products |
By Christoph Hammerschmidt

TC50 provides low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders. It only requires low compressive force to deform under assembly pressure. As a result, stress on components, solder joints and leads is minimized. Through its paste-like consistency, the thermal paste can be dispensed in a controlled manner to produce different thicknesses in line with specific application requirements. TC50 is a one-component, RoHS compliant product.

Ideal for automated dispensing machines serving a wide range of bond line applications, as well as rework and field repair situations, TC50 is aimed at automotive ECUs (electronic control units), power supplies and semiconductors, as well as memory and power modules, microprocessors and consumer electronic products. It can be packaged in syringes or cartridges, or bulk packaged in pails as required.

Delivering thermal conductivity of 5.5 W/m-K and heat capacity of 1 J/g-K, TC50 is typically suitable for all bond lines over 0.15 mm thick.

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