Thermal interface paste provides enhanced thermal conductivity for power modules
This so called thermal interface material greatly reduces the contact resistance between the metal areas on the power semiconductor and the heat sink. On Infineon’s EconoPACK+ of the new D Series, the contact resistance between the module and heat sink drops by 20 percent. With a high filler content, the material reliably applies its improved properties of thermal contact resistance from the first moment the module is switched on. There is no need for a separate burn in cycle usual on many comparable materials with phase change properties.
The development of the new heat conducting material focused on ease of processing in the form of honeycombs stencil-printed on modules. This prevents air from becoming trapped in the link to the heat sink. Also, the heat conducting material does not contain any substances harmful to health, meeting the requirements under the Directive 2002/95/EC (RoHS). In addition, the TIM is free of silicone and does not conduct electricity.
More information at www.infineon.com/TIM
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Visit Infineon Technologies at www.infineon.com
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