Thermal management substrate receives UL recognition
The environmentally-friendly thermal management substrate solutions are enabling customers to add another high-performance material choice to their design tool box. The Nanotherm LC material not only allows the customer to create a design based upon a conventional PCB, but also the ability to add the circuit to any 3D shape – creating a Circuit-on-Heat Sink solution.
The nano-ceramic materials make electronic and LED devices shine brighter, last longer or function far more efficiently. The company provides solutions to complex power consumption problems in the automotive, industrial and consumer domains, with a technology portfolio that includes Nanotherm LC (Laminated Copper) – a high-performance MCPCB (metal core PCB) for thermally challenging electronics.
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