Thermal nanomaterial startup sees €1.5m backing
Carbodeon’s has patented technology for additives in thermally conducting polymers for heat management in electronics and LED systems, as well as metal plating and selected polymer coating applications. The company provides different grades of Ultra-Dispersed NanoDiamonds to boost lifetime and thermal conductivity in electronic materials, automotive parts and industrial manufacturing line components.
There is an increasing demand for thermally conductive polymers which retain electrically isolating properties, and the company has developed ways ot use boron nitride, alumina and diamond in the polymers. Small additions of uDiamond with boron nitride or alumina provide gains in thermal conductivity of 100% or more without compromising electrical or mechanical properties. The typical diamond concentration is 1%, altough additions as low as 0.03% can be used in cost sensitive applications.
The performance improvement is driven by the high thermal conductivity of the diamond material at over 2000W/mK, the small particle size and the active surface chemistry. The company is working extensively in thermoplastic compounds used for heat spreaders and secondary heat sinks, as well as thermal interface materials based on silicones and epoxides, and the funding will be used to accelerate this development.
The funding comes from Straightforward Capital, a Finnish venture capital firm, and follows major financing already received from biotech and advanced materials sector investor Enso Ventures.
“With these investments we can expand our manufacturing technology and extend our global presence,” said Vesa Myllymäki, CEO of Carbodeon. “This funding, combined with our innovative partnerships with customers and partners will enable us to grow significantly within our key application areas.”
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