Thermal sensors for DDR3 memory modules expand cloud computing portfolio
The digital thermal sensors support both a 3.3V and lower-power 2.5V SM-Bus and I2C interface for improved system power efficiency and compatibility with both existing and emerging serial bus controllers.
For further power savings, advanced on-die power management features minimise power consumption during critical modes, such as when mobile or fault-tolerant enterprise systems are operating on battery power.
The new product family includes a stand-alone temperature sensor (TS3000GB2), as well as one with an integrated 256-byte EEPROM array (TSE2002GB2) on a single, monolithic die for non-volatile storage of user information, such as system configuration data for the Serial Presence Detect (SPD) feature of the memory module.
The devices are said to exceed the requirements set forth by the Joint Electron Device Engineering Council (JEDEC) JC42.4 specification for Grade B temperature sensors, providing ±1°C temperature sensing accuracy over the entire temperature range of -20°C to +125°C.
In addition, an innovative high-performance analog-to-digital converter (ADC) enables up to 12-bit (0.0625°C) programmable resolution with industry-leading conversion time, dramatically improving precision across the full temperature range.
Both the TS3000GB2 and TSE2002GB2 support SM-Bus and I2C protocols and specifications, including timeout requirements critical for next generation systems, along with input glitch filtering and power-up voltage hysteresis to enhance fault tolerance in any customer system design.
The IDT temperature sensors are currently sampling to qualified customers. They are available in 8-pin DFN and TDFN packages that are RoHS compliant.
For additional information, visit www.idt.com/go/TempSensor
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