Thermally enhanced laminates and prepregs
The 92ML laminate materials provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.
The laminate materials are available with up to 4-oz copper cladding; thick enough to meet today’s most demanding power distribution requirements and feature high thermal conductivity of up to 3.5 W/mK (in-plane) in combination with the relative ease and familiarity of epoxy based systems. The relatively high Tg value of 160°C in combination with a low Z-axis coefficient of thermal expansion of 22ppm/°C (<Tg) and 175ppm/C (>Tg) ensure that the 92ML materials survive lead free solder exposures and board reliability testing. The excellent rheological characteristics of the 92ML prepregs enable a high degree of resin flow; a critical element of high power multi-layer board processing.
Additionally, 92ML laminates are also offered in combination with an aluminum plate to form an insulated metal substrate (IMS). This product is known as 92ML StaCool™ laminate. In this configuration, the product has an integrated heat sink that can be machined and formed to serve as a mechanical chassis in the final application. 92ML StaCool laminate is characterized as having a high level of thermally stable adhesion to the aluminum substrate. This laminate withstands over 7 minutes of 288°C solder exposure enabling sufficient time for final product to be assembled without issues.
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