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Thin accelerometer packages suit wearable, health/medical applications

Thin accelerometer packages suit wearable, health/medical applications

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By eeNews Europe



Kionix developed its tri-axis accelerometer in 2004, followed by introduction of the first ‘thin’ 0.7-mm tri-axis accelerometer in 2013: this offering of full-featured ‘ultra-thin’ low-power accelerometers follows that line. The company positions the KX112 and KXCJB as suited primarily for mobile, PC/tablet and wearable applications, and adds that it will continue to expand the portfolio to include automotive and heavy-duty industrial applications.

The KX112 tri-axis accelerometer is the thinnest 2×2 accelerometer available, and has full 16-bits of resolution and excellent stability; it features built-in digital algorithms for detecting motion for power management, free fall for device protection or warranty monitoring, an orientation engine for portrait/landscape detection, and tap/double-tap for user interface functionality. It also incorporates Kionix’sFlexSet technology, allowing fine granularity for balancing power and performance. The KX112 has the largest FIFO/FILO buffer available on a mass-produced accelerometer. With 2048 bytes available, the rest of the system can sleep while the device i recording more data than any other accelerometer on the market, enabling superior power-savings and event context. See next page for feature list.

The KXCJB is the thinnest accelerometer available in any footprint, measuring just 3 x 3 x 0.45 mm thick. It supports the drive for thinner smartphones, tablets, PCs and hard disc drives as well as compact wearables such as activity monitors and smartwatches. The unique form-factor is half the thickness of most accelerometers on the market. This brings the ability to embed motion detection and motion sensing capabilities into a host of new devices such as badges, access cards, and payment/smart cards, while also opening up possibilities of maintaining low profiles when mounting on or in glass, plastic and other thin structures.

Rohm Semiconductor; www.rohm.com/eu


Next page; device feature lists…

KX112 features include;

2 x 2 x 0.6 mm LGA

User-selectable g range and output data rate

User-selectable 8-bit low resolution or 16-bit high resolution mode

Digital high-pass filter outputs

Embedded 2048 byte FIFO/FILO buffer

Low power consumption

Internal voltage regulator

Enhanced integrated directional Tap/Double-Tap and device-orientation algorithms

User-configurable wake-up function

Free fall engine

Digital I²C up to 3.4MHz

Lead-free solderability

Excellent temperature performance

High shock survivability

Factory programmed offset and sensitivity

Self-test function

KXCJB features include;

Ultra-thin at just 0.45 mm

Low current consumption: < 1 µA in standby, 10 µA at low resolution, and 135 µA at high resolution

Internal voltage regulator

8-bit, 12-bit, and 14-bit resolution

Supply voltage range: 1.8 V to 3.6 V

±2g, ±4g or ±8g user-selectable ranges

I2C digital communication interface

Embedded features

User-configurable motion wake-up function

Programmable interrupt engine

Self-test function

RoHS compliant

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