Thin film wire bond resistors offer customization capabilities

Thin film wire bond resistors offer customization capabilities

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By Graham Prophet

The WBR Series top-contact resistors are designed to deliver ultra-stable, high-reliability performance in a range of hybrid, medical, test & measurement, military/defence, and other applications that require stable thermocompression, epoxy, or ultrasonic bonding attachment.


Diced to small 0202 (0.02 x 0.02 in./ 0.5 x 0.5 mm) chip outlines with extremely tight dimensional tolerances (±0.003 in.), WBR Series top-contact, bottom-isolated resistors are ruggedly constructed and in addition to ohmic value, can be specified for film, substrate, termination materials, TCR values, and resistive tolerances. The series is tested to MIL-STD-202 MTD 106, 107, and 108, as well as MIL-PRF 55342.


Standard design and material options for WBR Series wire bond resistors include: 0202 chips with silicon or glass substrate material, silicon chrome (SiCr) or tantalum nitride (TaN) film, and bondable gold or aluminum terminations. Standard performance options include resistive values spanning 1Ω to 4 MΩ, four TCR values: ± 25, ±50, ±100, and ±150 ppm/°C, and four tolerance values: 5%, 1%, 0.5%, and 0.1%. All of these standard offerings may be customized to suit individual application requirements. Operating temperatures for the series span -55°C to +125°C, and rated voltage is 125VDC (max.)





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