Third-generation high efficiency power modules feature an EZPair package

Third-generation high efficiency power modules feature an EZPair package

New Products |
By eeNews Europe

The new generation AOZ5019 supersedes the previous generation in a smaller package and with a higher frequency. The AOZ5019 is offered in a 23-pin 3.5 mm x 5 mm QFN package that integrates a dual gate driver and two optimized MOSFETs which combined produce a high efficiency DC-DC synchronous buck power stage and allows switching frequencies up to 1.5 MHz. The new device enables high power density voltage regulator solutions ideal for notebook PCs, servers, and graphic cards applications.

The AOZ5019 utilizes AOS’s proprietary state-of-the-art trench MOSFET and packaging technologies which improves the efficiency, thermal performance, and package size over the previous generation solution. For example, the efficiency is 1% higher at a heavy load condition compared to leading competitor, the package size has been reduced to 3.5×5 mm, and effective thermal pad area has been improved by three times compared to discrete solutions.

Availability and Pricing

The AOZ5019 is available immediately in production quantities. The unit price of 1,000 pieces is $1.05.

More information about the AOZ5019 at

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