Three-stage WiFi PA modules target 802.11b/g/n applications
Each is a high-performance, highly integrated solution with minimal external components, eliminating the need for any external matching components and greatly reducing layout area, bill of materials (BOM), and manufacturing costs for the customer application.
Built with an advanced InGaP HBT process, these PAs have high linear output power while maintaining excellent power added efficiency (PAE). RFPA5200 comes in a 4 mm x 4 mm x 1 mm, 10-pin laminate package, while RFPA5201 comes in a 14-pin, 7 mm x 7 mm Multi-Chip Module (MCM).
Key features of the RFPA5200 include an output power of 27dBm, 5V with <3% dynamic EVM, PAE of 21 percent and high gain of 33 dB. The RFPA5201 offers an output power of 29dBm with EVM of 3% (11n MCS7 HT40), PAE of 18.5 percent and a gain of 33 dB.
Both devices are input and output matched to 50 Ω and feature integrated power detector, biasing, harmonic filtering, and enable pin.
Typical applications include consumer premise equipment (CPE), picocells and femtocells, data cards and terminals, wireless access points, gateways, routers and set top box applications, and ISM band transmitter applications.
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