Thunderbolt, USB-C interfaces for repairable computers
Intel is proposing a three-board modular framework for modular laptops and PCs based on its Thunderbolt protocol and the USB-C connector format.
The design will allow more easily replaceable modules to allow users to easily update a system with a new processor, the latest WiFi protocols or new types of interface. This is increasingly being demanded to meet repairability and environmental legislation.
This is the approach already taken by Framework, which has raised $44m so far for its modular laptops to reduce electronic waste and works with Infineon Technologies for the USB-PD power delivery technology.
Electronic waste (e-waste) is a growing problem. Every year, over 60m tons of e-waste is generated, and computers are responsible for almost 70% of this. Less than 25% of e-waste is collected and less than 12% of e-waste is recycled with over 85% being burnt, causing harmful pollution and environmental poisoning.
Gurpreet Sandhu, Vice President, Platform Engineering Group, Reshma PP, Director System Design, Platform Engineering Group and Roberta Zouain, Sustainability Product Strategy & Marketing Manager, Client Segments have detailed a three board laptop design that maximizes PCB Panel utilization, reduces PCB waste and supports different system configurations with minimal modifications. This supports standardised modules like M.2 SSDs and Core Board, users can effortlessly enhance their storage, and upgrade the system with next-generation processors.
The modular design streamlines the repair process and contributes to the right-to-repair initiative allowing for the replacement of specific damaged parts and IO without the need to discard the entire motherboard. The creation of universal I/O boards (left and right I/O boards) that can be used across various platforms or market segments, which includes all types of laptops but also desktop PCs.
The I/O boards for Premium Modular designs are engineered to be common between the fanless Thin & Light system, which operates within a 10W power envelope, and the premium fanned designs, which function within a 20W (single fan) and 30W (dual fan, WiFi) power envelope.
This commonality allows for greater flexibility and efficiency in the design and manufacturing process across both fan and fanless systems. The I/O port capabilities of the 10W fanless and 30W fanned systems are identical and can be reused.
Although three segments have different system constraints with different system floorplans, which makes it challenging to have a common I/O board across segments, the common I/O board between the fan and fan less systems have been designed to address all these challenges. The I/O boards are designed in such a way that they can be reused across consumer and commercial segments.
Thunderbolt is different from the USB4.0 protocol but can run on the same connectors. The subsystem-level replaceable modules would use a Type-C connector on an FPC (Flexible Printed Circuit) and a Type-C connector on an M.2 PCB. These modules significantly reduce repair costs and simplify the repair process in the event of port or connector damage at the end-user level.
Thunderbolt supports a full 40 Gbit/s data transfer speed, compared to USB4 which can offer either 20 Gbit/s or 40 Gbit/s depending on the devices. Thunderbolt typically supports connecting multiple high-resolution displays, while USB4 may only support one.
Thunderbolt requires stricter Intel certification, ensuring consistent quality across devices, while USB4 has less stringent certification requirements.
Thunderbolt with a Type-C connector is a high-speed versatile interconnect with multiple end device options along with a power source to the system. Intel says Type-C connectors have been reported to get damaged more often than other IO ports, and this approach is a way to address this repairability issue by replacing modules.
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