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TI BAW-based ICs for next-gen connectivity and comms infrastructure

TI BAW-based ICs for next-gen connectivity and comms infrastructure

New Products |
By Rich Pell



The first two devices developed with the new BAW technology are the SimpleLink CC2652RB wireless microcontroller (MCU) and the LMK05318 network synchronizer clock. The new chips, says the company, will help system designers streamline design logistics while enabling stable, simplified, and high-performance data delivery, allowing for potential overall development and system cost savings.

The devices integrate reference clocking resonators to provide the highest frequency in a small form factor, enabling improved performance and increased resistance to mechanical stresses, such as vibration and shock, over discrete clocking and quartz-crystal devices. As a result of stable data transmission enabled by TI BAW technology, says the company, data synchronization of wired and wireless signals is more precise and allows for continuous transmission.

Offered as the industry’s first crystal-less wireless MCU on the market, the SimpleLink multi-standard CC2652RB integrates a BAW resonator within its quad flat no-lead (QFN) package, eliminating the need for an external high-speed 48-MHz crystal. In addition, says the company, the CC2652RB is the lowest power multi-standard device supporting ZigBee, Thread, Bluetooth low energy and proprietary 2.4-GHz connectivity solutions on a single chip. The CC2652RB works in the full -40°C to 85°C temperature range, unlike many crystal-based solutions currently on the market.

The ultra-low-jitter single-channel LMK05318 network synchronizer clock for 400-Gbps links helps systems transmit more data faster while also providing higher margin for system jitter budgets than competing devices, says the company. The LMK05318 is claimed to deliver the lowest bit errors for 56-Gbps and emerging 112-Gbps pulse-amplitude modulation-4 links – enabling better network performance. Other cited benefits include no in-system programming required, simplified power-supply requirements, and a reduced bill-of-materials (BOM) for ancillary components.

Preproduction samples of the CC2652RB are available in a 7 x 7-mm very-thin QFN (VQFN) package with pricing starting at $3.55 in 1,000-unit quantities. A SimpleLink CC2652RB wireless MCU-based TI LaunchPad development kit is available for $39.99.

The LMK05318 is available in production quantities in a 48-pin, 7 x 7-mm VQFN package with pricing starting at $11.44 in 1,000-unit quantities. An LMK05318 evaluation module is available $399.00.

Texas Instruments

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