RFAB2 is 30 percent larger than RFAB1. The two fabs together will offer more than 630,000 square feet of clean room space and at full production the fabs will produce 100 million analog chips per day.
“Our 300-mm wafer fab expansion plays an important role in TI’s future growth and in our ability to support customers’ demand for decades,” said Mohammad Yunus, senior vice president responsible for manufacturing operations. “I’m proud of the progress that’s been made and I’m looking forward to continuing to ramp 300-mm production in RFAB2 over the coming months.”
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