TI breaks ground on 300mm US fab
Texas Instruments (TI) has started construction of its 300mm wafer fab in Sherman, Texas.
“Today is an important milestone as we lay the groundwork for the future growth of semiconductors in electronics to support our customers’ demand for decades to come,” said Rich Templeton, CEo of TI. “Since our founding more than 90 years ago, we’ve operated with a passion to create a better world by making electronics more affordable through semiconductors. TI is excited to bring advanced 300-mm semiconductor manufacturing to Sherman.”
The potential $30bn investment includes plans for four fabs to meet demand over time, supporting as many as 3,000 direct jobs. The new fabs will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere.
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The new fabs will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold. Advanced 300-mm equipment and processes in Sherman will further reduce waste, water and energy consumption.
Lead times for fab equipment are currently 24 months, and production from the first Sherman fab is expected in 2025.
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The fabs will complement TI’s existing 300mm fabs, which include DMOS6 (Dallas), RFAB1 and the soon-to-be-completed RFAB2 (both in Richardson, Texas), which is expected to start production later this year. LFAB in Lehi, Utah, recently acquired from Micron, is expected to begin production in early 2023.
“These investments in long-term manufacturing capacity further extend the company’s cost advantage and provide greater control of our supply chain,” Templeton said.
“This ground breaking marks the next era of semiconductor production in Sherman that promises to create decades of economic opportunity and improve the quality of life for the region,” said David Plyler, mayor of Sherman. “We are grateful for TI’s long and continued investment in Sherman and look forward to our continued partnership.”
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