TI breaks ground on second Lehi 300mm fab
Texas Instruments (TI) has broken ground on its new US 300mm semiconductor wafer fabrication plant in Lehi, Utah.
The new fab, LFAB2, will connect to the existing 300mm wafer fab in Lehi which TI acquired from memory maker Micron Technologies in 2021. This started producing analog and embedded processors at the end of last year.
The $11bn investment in LFAB2, with anticipated support from the US CHIPS and Science Act, will create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production available as early as 2026.
The fab will be 100% powered by renewable energy and recycle water at nearly twice the rate of the existing LFAB1 in Lehi. The fab is designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability at LEED Gold version 4.
- TI to build next 300mm fab in Utah
- TI buys Micron’s Utah fab for $900m
- Texas Instruments’ Lehi wafer fab starts production
“Today we take an important step in our company’s journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” said Ilan. “At TI, our passion is to create a better world by making electronics more affordable through semiconductors. We are proud to be a growing member of the Utah community, and to manufacture analog and embedded processing semiconductors that are vital for nearly every type of electronic system today.”
“TI’s growing manufacturing presence in Utah will be transformative for our state, creating hundreds of good-paying jobs for Utahns to manufacture critically important technology,” said Utah Governor Spencer Cox. “We are proud that semiconductors – made in Utah by Utahns – will power the innovation that is foundational to our country’s economic and national security.”
The company announced $9m for the Alpine School District to develop the state’s first Science, Technology, Engineering and Math (STEM) learning community for all students in kindergarten through 12th grade. The multiyear program will embed STEM concepts more deeply into coursework for the district’s 85,000 students and provide STEM-oriented professional development for its teachers and administrators. The district-wide program will equip students with essential STEM skills, such as critical thinking, collaboration and creative problem-solving to succeed after graduation.
“We are excited this partnership will help our students develop essential knowledge and skills, preparing them for success in life and possible careers in the technology sector,” said Alpine School District Superintendent, Dr. Shane Farnsworth. “Working together with the city of Lehi, Texas Instruments, and our schools, this collaborative investment will impact students and their families for many generations to come.”
Alongside LFAB1 and 2, the other 300mm fabs at TI are DMOS6 in Dallas and RFAB1 and RFAB2 in Richardson, Texas. TI is also building four new 300-mm wafer fabs in Sherman, Texas (SM1, SM2, SM3 and SM4), with production from the first fab as early as 2025.
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