TI integrates transformer into DC-DC converter in chip package
Texas Instruments has developed a proprietary integrated transformer technology that enables a 500mW high-efficiency isolated DC-DC converter in a surface mount chip package.
The integrated transformer technology allows the UCC12050 to have a low electromagnetic interference (EMI), while the 2.65mm height enables designers to reduce their solution volume by as much as 80% compared to discrete solutions and 60% compared to power modules. In a 16pin small-outline integrated circuit (SOIC) package measuring 10.3 x 10.3 x 2.65mm, the UCC12050 has 60 percent efficiency, which TI says is twice that of competing devices of similar size, and twice the power density of comparative isolated power modules.
The chip scale DC-DC converter is aimed at industrial designs and provides 5kVrms reinforced isolation and 1.2kVrms working voltage protection against high-voltage spikes in designs for grid infrastructure and medical equipment with an extended -40°C to 125°C operating temperature range. Another version, the UCC12040, provides all of the same benefits with 3-kVrms basic isolation.
The low primary-to-secondary capacitance of 3.5pF is optimized for EMI performance, and a quiet control scheme uses a closed-loop topology without low dropout or external feedback components for easier compliance with the CISPR 32 Class B EMI tests, with margin, on a two-layer printed circuit board. As a result the chip does not need the external filter components such as ferrite beads normally required to meet EMI certification, reducing component selection and design time.
The reinforced isolation in the DC-DC converter has 8mm creepage and clearance is used for protection and robustness against ground potential differences.
The UCC12050 and UCC12040 are available in volume production from TI and authorized distributors. Pricing starts at US$3.90 and US$3.15, respectively, in 1,000-unit quantities. Engineers can evaluate the chip with the UCC12050EVM-022 evaluation module for US$99.
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