TI IsoShield power modules target data centres and EVs
Texas Instruments has launched two new isolated power devices aimed at applications where board area, weight and electrical noise all become harder to manage as system power climbs. The UCC34141-Q1 and UCC33420 use TI’s proprietary packaging approach to combine a planar transformer with the isolated power stage in a tighter module, and TI says the resulting IsoShield power modules can deliver up to three times the power density of discrete alternatives while cutting solution size by as much as 70%.
IsoShield power modules
This is really a packaging story as much as a silicon one. Engineers have been pushing for smaller isolated bias supplies for years, especially in EV traction inverters, industrial systems and increasingly dense data-centre hardware. TI’s pitch is that by pulling the transformer into the package and reducing the amount of external circuitry, it can free up board space, reduce height and trim some of the material and design overhead that comes with more traditional isolated power designs.
The company says the modules support functional, basic and reinforced isolation, and that the higher integration also helps with reliability and development speed. In a separate March technical note [PDF], TI also points to thermal, EMI and immunity benefits, which is where these parts either become genuinely useful or just another neat packaging demo. For power engineers, that detail matters more than the slogan.
What TI is launching
The larger of the two parts, the UCC34141-Q1, is a mid-voltage module for 6 V to 20 V designs in a 5.85 mm × 7.5 mm × 2.6 mm package. The smaller UCC33420 is aimed at 5 V rails in a 4 mm × 5 mm × 1 mm package. TI says the new devices can deliver up to 2 W while helping designers shrink isolated power stages that would otherwise take substantially more board space.
That makes them relevant to automotive and industrial designs, but there is also an obvious data-centre angle. As previously reported by eeNews Europe when TI outlined an 800 VDC architecture for AI data centres, the company has been trying to tell a broader story about how it fits into higher-density power delivery for next-generation compute infrastructure. These new modules sit lower down the chain, but they fit that same theme of squeezing more function into less board area.
IsoShield power modules at APEC 2026
TI is showing the new parts at APEC 2026 in San Antonio, including use in a 300 kW silicon-carbide traction inverter reference design. The company also says it will show other power hardware for data centres, robotics, sustainable energy and USB Type-C applications, including an 800 V to 6 V DC/DC power distribution board for AI compute trays.
Availability is immediate in preproduction and production quantities through TI, with evaluation modules, reference designs and simulation models also available. On its own, this is not the kind of launch that will reshape either the EV or data-centre market overnight. But it is a useful reminder that a lot of the progress in power electronics now comes from packaging, integration and the boring physical constraints of real hardware. That is exactly where TI wants these IsoShield power modules to land.
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