TI to build next 300mm fab in Utah
Texas Instruments is to build its next 300mm semiconductor wafer fab in Lehi, Utah, alongside the plant it acquired from Micron in 2021.
Once completed, TI’s two Lehi fabs will operate as a single fab.
This follows a 300mm fab in Richardson, Texas, that came online late last year and four 3000mm fabs being built in Sherman, Texas.
- Production starts at second Richardson wafer fab
- Breaking ground on 300mm US fab
- Four new 300mm fabs planned in Sherman, Texas
The $11bn project in Lehi is the largest economic investment in Utah history and will create 800 semiconductor jobs at TI.
“This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” said Haviv Ilan, the incoming president and chief executive officer who takes over from Rich Templeton in April.
“Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI’s future,” he said. “With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity,” said Ilan.
Semiconductor skills are a key issue, and is to invest $9 million to improve student opportunities and outcomes with the local school system.
“Companies like Texas Instruments continue to invest in Utah because of our world-class business climate and exceptional workforce,”
“TI’s new semiconductor fab will solidify Utah as a global semiconductor manufacturing hub for generations to come,” said Spencer Cox governor of Utah state.
- R&D programme for sustainable semiconductor production
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- European lead for Semiconductor Sustainability Consortium
The fab will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold. Plans include recycling water at nearly double the rate of the existing Lehi fab. Using the latest 300mm equipment and processes in Lehi will further reduce waste, water and energy consumption per chip.
Construction of the new fab is expected to begin later this year 2023, with production by 2026. The cost of the new fab is included in TI’s previously announced capital spending plan to expand manufacturing capacity and will complement TI’s existing 300mm fabs, which include DMOS6 in Dallas, RFAB1 and RFAB2 in Richardson, Texas, and LFAB in Lehi.
www.ti.com/about-ti/company/ti-at-a-glance/manufacturing/lehi.html
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