TI to exhibit low power MCUs, AI at the edge

TI to exhibit low power MCUs, AI at the edge

New Products |
By Peter Clarke

Texas Instruments will demonstrate a range of embedded processing and connectivity products at Embedded World April 9 through 11 in Nuremberg, Germany.

TI’s exhibit in hall 3A, booth 131 will be relevant to such applications as robotics, energy transition and electric vehicles, the company said.

TI will demonstrate the use of ARM-based processors with integrated AI acceleration can be used to drive multi-display human-machine interface systems.

In the last year TI has added more than 100 products to its Cortex-M0+ range of MCUs and these will be on show.

TI employees are also speaking in the conference stream at Embedded World on such topics as:

  • A multi-protocol IO-link gateway solution for edge IoT
  • How mmWave radar MMICs assist sensor designs for robots
  • Heterogeneous AI-enabled systems using hardware-accelerated vision pipelines on embedded processors
  • High-accuracy, low-power secure ranging using Bluetooth channel sounding
  • Uniform benchmarking of ARM-based SoCs executing machine learning

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