TI to receive up to $8bn in US CHIPS Act funds
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Texas Instruments has signed preliminary agreement to receive up to $1.6bn in grants under the US CHIPS and Science Act for its fabs in Texas and Utah
The funding for the TI fabs in Sherman, Texas and Lehi, Utah, 300mm fabs would also include $6bn to $8bn in investment tax credit to drive internal production to 95% by 2030 through $18bn of investment, which shows the scale of support through the CHIPS Act. The company is also bringing much of its test and assembly in house in Malaysia.
The company also expects to receive $10 million in proposed funding for workforce development for 2,000 new TI jobs and thousands of indirect jobs for construction, suppliers and supporting industries.
“Our investments further strengthen our competitive advantage in manufacturing and technology as we expand our 300mm manufacturing operations in the U.S. With plans to grow our internal manufacturing to more than 95% by 2030, we’re building geopolitically dependable, 300mm capacity at scale to provide the analog and embedded processing chips our customers will need for years to come,” said Haviv Ilan, president and CEO of Texas Instruments.
The proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to:
Construct and build the SM1 cleanroom and complete pilot line for first production;
Construct and build the LFAB2 cleanroom for first production; and
Construct the SM2 shell.
LFAB2 follows the acquisition of a fab in Lehi from Micron Technology that has been repurposed from memory to analog and embedded process technologies.
These connected, multi-fab sites benefit from shared infrastructure, talent and technology sharing, and a strong network of suppliers. They will produce semiconductors in 28nm to 130nm technology nodes, which provide the optimal cost, performance, power, precision and voltage levels required for TI analog and embedded chips
“With this proposed investment we would help secure the supply chain for these foundational semiconductors that are used in every sector of the US economy,” said US Secretary of Commerce Gina Raimondo.
The 300mm TI wafer fabs will be entirely powered by renewable electricity. Additionally, all of TI’s new 300mm fabs are designed to meet LEED Gold standards for structural efficiency and sustainability. The 300mm manufacturing facilities bring advantages in reducing waste and improving water and energy consumption per chip.
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