Tin-lead power modules address defence, avionics applications

Tin-lead power modules address defence, avionics applications

New Products |
By Rich Pell

The SnPb BGA package simplifies PC board assembly for suppliers in these industries by providing:

– Surface mount vs through-hole PCB assembly.

– Complete, encapsulated DC/DC regulator circuit in one BGA package vs high component-count, unverified discrete solution.

– 100% tested point-of-load regulator solutions vs requiring verification and supervision of discrete circuit point-of-load regulator solutions.

– Simpler cleaning under the µModule BGA package due to higher standoff compared to flat LGA or QFN packages.

– Reflow temperature identical to the other tin-lead components on the PCB vs higher temperature required for point-of-load regulators with Pb-free solder paste.

µModule power products with SnPb BGA packages are offered in four DC/DC converter categories: (1) step-down or buck converters with single and multiple outputs, (2) buck-boost converters, (3) isolated converters, and (4) converters with PMBus digital telemetry with READ and WRITE data capability.

Lead-free (SAC305) versions of these devices and other µModule products in both BGA and LGA packages are available at

The tin-lead capability is summarised at;

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