Tiny IoT WiFi SIP module
With a size of just 6-mm x 6-mm (only 1/10 of the IoT WiFi PCBA modules, or less), this breakthrough technology IoT SiP module integrates MCU, memory, power management and RF parts, to provide a high performance, low cost, and low power consumption for connected products.
The LTP0201 SiP module includes a low power 32-bit RISC MCU, on-chip SRAM and internal SPI NOR Flash, can be applied in a hostless mode (no external MCU) or hosted mode where it connects to an 8/16/32-bit microcontroller through UART/SPI, or SDIO interfaces. It also can be used with sensors and other specific application devices through its GPIOs. The LTP0201 supports 802.11 b/g/n with integrated TCP/IP protocol stack, and supports 1×1 MIMO; the time of waking up to transmit packets is within 2 ms, and the standby power consumption is less than 1.0 mW in DTIM3 low power mode. For security, it integrates WEP, TKIP, AES, and WAPI HW secure engines.
LTP3226, a WiFi + Bluetooth combo SiP, was announced together with LTP0201. It has a low power 32 bit RISC MCU, on-chip SRAM and internal SPI NOR Flash, and support 802.11 b/g/n, Bluetooth 4.1/BLE.
"In 5 years, more than 60% IoT and wearable products will incorporate SiP modules because of its mini size and more consistent RF performance," Dave Pang, General Manager of Longsys Technology predicted. According to some marketing research firms, there will be more than 25 billion devices connected to internet by 2020.
"Longsys Technolog IOT SiP products can provide a convenient way for developers to add connectivity to their smart products, at a wide range from wearables and home automation, to smart lighting and industrial applications, in a very compact size. It allows faster, simpler development for device manufacturers to produce desirable, functional IoT and wearable products," Dave Pang adds, "Together with Longsys Technology optimized firmware, and Wukoon@™ IoT cloud service, it helps customers targeting IoT markets to incorporate sophisticated predictive data analytics capabilities into their products, and helps developers to rapidly turn great ideas into market leading IoT products and applications."
Longsys Technology will be demonstrated the following products during CES 2016:
LTP0201, the smallest IoT WiFi SiP module currently available in the industry, at 6mm x 6mm. It is specifically designed for low-power, small form-factor IoT applications.
LTP3226, a WiFi + Bluetooth/BLE combo IoT SiP, provides both WiFi and Bluetooth connections, is a perfect solution for IoT products which need to interact with Bluetooth devices like wristbands, smart watches, and other high-end wearables.
LTM5316 smart Super Gateway, it incorporates a 650 MHz processor and on-board DRAM and flash memory, and includes Wi-Fi, Bluetooth/BLE and ZigBee connectivity. It is designed for use as home hubs, gateways edge computing and in industrial settings. LTM5216 supports local storage and computational capabilities which generally only be supported by large-scale cloud servers.
IoT Software Stack: Longsys offers an optimized IoT software stack and tools based on Qualcomm IoT platform to accelerate product development. Developers can focus on application framework development while not building low-level software libraries.
Wukoon cloud data service: Longsys Technology works with IBM on the SuperVessel IoT cloud data service, to provide high efficiency data storage, data analysis, and future Artificial Intelligence (AI), Machine Learning service. Wukoon@™ can provide 10 times plus read/write speed, and save more than 50% storage space, by using Time Series Data Base optimized for IoT.
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