TLPS process boosts power density in surface mount modules
Developed in partnership with power electronics designers to create a leadless multichip solution for high-efficiency and high-density power converters, the KONNEKT technology uses transient liquid phase sintering (TLPS). This is a low-temperature reaction of a low melting point metal or alloy with a high melting point metal or alloy to form a reacted metal matrix, forming a metallurgical bond between two surfaces. Depending on the alloy, TLPS may have a re-melt temperature in excess of 600° to provide a higher performance connection for power devices.
This means the power devices can be mounted to PCBs using existing reflow processes, avoiding the need for specialist processes, but cannot easily be re-worked. For example, capacitors mounted using KONNEKT technology have the unique ability to be mounted in a low-loss orientation to further increase their power handling capability.
The first release of KONNEKT technology will use KEMET’s U2J high stability dielectric to create a low-loss, low-inductance package capable of handling very high ripple current in the hundreds of kilohertz range.
“Power electronics engineers asked for a solution to help achieve higher efficiency in smaller packages,” said Dr John Bultitude, KEMET Vice President and Technical Fellow. “KEMET’s KONNEKT technology delivers through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.”
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