Top cooled MOSFET package for motor control

New Products |
By Nick Flaherty

Onsemi has developed a top-cooled package for silicon MOSFETs in motor control and DC-DC converters to eliminate the PCB from the thermal path.

The TCPAK57 package measures 5mm x 7mm with a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density and boosts reliability.

The initial portfolio of devices launched at electronica this week has 40V, 60V and 80V devices operating at junction temperatures (Tj) of 175°C with RDS(ON) values down to 1mΩ. The gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.

The devices are AEC-Q101 qualified and PPAP capable for automotive designs such as electric power steering and oil pumps and use gull wings leads to allow inspection of solder joints and improve the board level reliability.

“Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.”

Samples of the new devices are available now with full-scale manufacture planned in January 2023.

Other articles on eeNews Power



Linked Articles