Top-side cooled SMD solution targets high power applications
This new packaging solution enables fast switching and high efficiency in reduced size and weight with a minimized total cost of ownership. The innovative top-side cooling concept of the package can leverage existing high voltage technologies such as the 600V CoolMOS G7 SJ MOSFET and the CoolSiC Schottky Diode 650V G6. The thermal decoupling of the printed circuit board and semiconductor enables higher power density or longer system lifetime, claims the manufacturer.
The four-pin configuration allows for separate pin source-sense to deliver undisturbed signal to the driver, providing higher efficiency at full load. Infineon offers optimized system solutions for high power designs by combining its CoolMOS G7 with CoolSiC G6 and EiceDRIVER families.
Infineon – www.infineon.com