Toshiba to build MOSFET back end plant in Japan
Toshiba Electronic Devices & Storage is to build a new back-end assembly plant for its MOSFET power semiconductors at its Himeji site in Japan.
This is part of a move to bring more assembly and packaging back under direct control rather than relying on third parties in Asia and China in particular.
Construction will start in June 2024, with production scheduled to start in spring 2025. The project will more than double Toshiba’s automotive power MOSFET production capacity at Himeji compared to this year.
Toshiba expects to see continued growth in demand for power MOSFETs in vehicle electrification and the automation of industrial equipment. The existing assembly plant on the site, established in 1982, currently has 1400 staff.
Most of the discrete power devices are produced at Toshiba’s fab in Kaga where the company announced a 300mm expansion earlier this year. Construction of this will start in spring 2023 with production starting in 2024, aligned with the increased assembly capacity at Himeji.
- Toshiba looks to two way split and sell off
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- 1200V SiC MOSFETs for industrial power conversion
Toshiba Electronic Devices & Storage is the remaining part of Toshiba which is currently being broken up into several parts.
toshiba.semicon-storage.com/ap-en/top.html
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