The SmartPodX platform uses horizontal racks that fully immerse computers and servers in a proprietary dielectric fluid, boosting performance and increasing compute densities in a fraction of the footprint, and lowering electricity consumption as a result.
Submer is showing SmartPods designed built to the latest OCP specifications at the 2019 OCP Global Summit this week in San Jose, California. Itis the first system to place the Cooling Distribution Unit (CDU) inside the fluid as a modular component. This allows the CDU to be easily replaceable without interrupting the servers, a ‘cool swap’ rather than a ‘hot swap’.
The SmartLift runs on a dedicated rail system along the front of the SmartPod installation, allowing engineers and techs to easily access computers and servers for replacement or maintenance. It also works with the CDU to provide the swap capability.
“The Open Compute Project exists to reimagine computing hardware and develop a set of standards that bring greater efficiency, scalability, openness, and impact – making all of our lives better. This makes the OCP Summit the perfect opportunity to launch our hyper-efficient immersion cooling system that will power the next generation of high-performance servers and supercomputers and usher in a new wave of research and technical innovation,” said Daniel Pope, CEO of Submer.