Tower licenses 3D stacked image sensor technology
The technology license is intended to be integrated into Tower’s stacked wafer BSI sensor platform manufacturing for time of flight (ToF), industrial global shutter and other CMOS image sensors on 300mm and 200mm wafers. Tower will also look at the use of Invensas technology to use in 3D integration technologies for use in a broader range of applications, such as memories and MEMS devices.
“Xperi’s leadership in direct and hybrid bonding technologies enables us to support the rapidly evolving requirements of our customer base as they develop next-generation applications,” said Dr. Avi Strum, Senior Vice President and General Manager of the Sensors Business Unit, Tower Semiconductor. “3D stacking architectures and integration are core to our strategy of providing the highest value, proven analog semiconductor solutions, including event-driven and time of flight sensors for mobile, automotive, industrial and high-end photography applications.”
With a recently released full design kit for hybrid bonding, Tower’s customers are now able to design products on two different wafers, an imager wafer and a mixed-signal CMOS wafer, that can stacked together with electrical connections on the pixel level. The separation of the design into two wafers allows high speed circuitry on the CMOS side, and high sensitivity pixels on the imager side. The high sensitivity is gained through backside illumination, and extremely low dark current, below 1 electron/sec per square micron at 60 degrees Celsius. Tower’s platform also allows the use of different Epi thicknesses for near infrared sensitivity enhancement.
Craig Mitchell, President of Invensas, a wholly-owned subsidiary of Xperi said, “Our ZiBond and DBI technologies support the manufacturing of a wide range of devices. Our partnership with Tower Semiconductor will help to deploy our foundational 3D integration technologies into a range of new sensors, in particular time of flight sensors, which we anticipate will be increasingly utilized in automotive, mobile and industrial applications.”
More information
Related news
Winbond adopts secure flash protocol from Nanolock
Dual-mode secure Bluetooth MCU from Redpine
Cybersecurity solution for industrial networking
Rambus launches cryptomanager root of trust core
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
