Tower partners for optical fiber die attach
Partners
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By
Peter Clarke
Speciality foundry Tower Semiconductor Ltd. (Migdal Haemek, Israel) is collaborating with Teramount Ltd. (Jerusalem, Israel) on connecting optical fibers to silicon chips.
Tower has said it will use Teramount’s ‘PhotonicPlug’ technology with its PH18 silicon photonic process and ‘bump-ready’ wafers.
The combination will allow the connection of a large number of fibers to a single chip for applications in datacenters, telecom networks, as well as in emerging applications such as artificial intelligence (AI) and sensors, Tower said.
“Through our collaboration with Teramount, we are able to offer our customers yet another tool to enable differentiated optical solutions,” sai. Ed Preisler, a technology director, at Tower, in a statement.
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