Transphorm, Weltrend extend integrated GaN System-in-Packages
Transphorm has worked with Weltrend Semiconductor to create a series of GaN System-in-Packages (SiPs) to simplify USB PD power delivery designs.
The WT7162RHUG24B and WT7162RHUG24C SIPs integrate the Weltrend high frequency multi-mode (QR/Valley Switching) Flyback PWM controller with the Transphorm 150mΩ and 480mΩ SuperGaN FETs. This follows a 240mΩ SiP developed last year.
Combining the FET and controller in a single package means the SiP can be optimized for low-profile USB-C power adapters for mobile/IoT devices such as smartphones, tablets, laptops, headphones, drones, speakers, cameras, and more.
The devices pair with USB PD or programmable power adapter controllers to provide a total adapter design and add features including the UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control. This allows developers to design high quality power supplies faster and with fewer components using the simplest design approach.
“When we launched our first GaN SiP last year, it was an important milestone in our company’s evolution. It demonstrated a new GTM strategy for the AC-to-DC power market,” said Wayne Lo, Vice President of Marketing, Weltrend. “We’re continuing to serve that space with a wider selection of devices designed to support a wider assortment of product power levels. A total packaged solution with Transphorm’s SuperGaN platform delivers design simplicity with unparalleled performance for devices now ranging from low 30W USB-C PD power adapters through to nearly 200W chargers, a unique Transphorm GaN capability.”
Some key advantages of Transphorm’s normally-off d-mode SuperGaN platform include best-in-class robustness (+/- 20 V gate margin with a 4 V noise immunity) and reliability (< 0.05 FIT) with the ability to increase power density by 50% over silicon. Weltrend’s elegant SiP designs harnesses those advantages along with its own innovative technologies to create a near plug-and-play solution that speeds design while reducing form factor size.
“SiPs are an important device option when considering the needs of adapter and charger manufacturers,” said Tushar Dhayagude, Vice President of Worldwide Sales and FAE, Transphorm. “These systems require effective power conversion that, while simple to use with integrated functionality, also minimize learning curves to ensure quick design in. The first device released validated the performance and versatility of a SuperGaN SiP. The new devices announced today validate both our companies’ deepening commitment to arming customers with choice.”
The WT7162RHUG24B and WT7162RHUG24C are currently sampling.
www.transphorm.com; www.weltrend.com.tw
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