Transphorm, Weltrend team for GaN System-in-Package

Transphorm, Weltrend team for GaN System-in-Package

Technology News |
By Nick Flaherty

Transphorm has teamed up with one of the leading suppliers of silicon power controllers for a GaN system in package (SiP) to simplify power supply designs.

Putting the USB Power Delivery (PD) Controller from Weltrend Semiconductor in the same package as the SuperGaN switches allows simpler pulse width modulated (PWM) power supply designs up to 100W with 93% efficiency using a flyback topology with QR Mode/Valley-switching multi-mode operation.

The WT7162RHUG24A is an integrated circuit designed for use in 45 to 100 watt USB-C PD power adapters charging smartphones, tablets, laptops, and other smart devices. Device samples will be available in the second quarter of 2023.

The new SiP integrates Weltrend’s WT7162RHSG08 multi-mode flyback PWM controller with Transphorm’s 240 milliohm, 650 volt SuperGaN FET. The surface mount device is available in a 24-pin 8×8 QFN package, reducing PCB size and enabling designs with a power density of 26 W/in3.

The SiP has a wide output voltage range for USB-C PD 3.0 and PPS from 3.3V to 21V and an adjustable switching frequency of up to 180 kHz to tune the EMI performance.

This allows Weltrend to offer a complete AC-DC system design using Transphorm’s SuperGaN technology, the WTDB_008 65W USB PD Power Adapter Evaluation Board. For Transphorm, it is another key proof point that validates its GaN devices’ ease of interface and performance and tap into Weltrend’s Asian customer base.

The integration includes an 700V ultra HV start-up current pulled directly from neutral line of the AC main voltage and means an external VDD linear regulator circuit is not required, reducing the board area.

“The WT7162RHUG24A is the industry’s first publicly announced SiP using Transphorm GaN. It enables manufacturers to develop a less expensive system solution given fewer components are required and a smaller PCB can be used among other advantages. It also reduces system development time. Effectively, we’re removing design barriers for adapter manufacturers,” said Tony Lin, President of Weltrend.

“Notably, this product also allows Weltrend to move into a new market. It is the first-ever SiP for our PWM controllers, validating our commitment to supporting high volume growth sectors. And, with the integration of the GaN FET, we’ve raised the level of performance output. A win for Weltrend, Transphorm, and our mutual customers.”

“The adapter fast charger market is a fast growing segment for GaN adoption today. We are gaining market share and continue to innovate, most recently with this GaN SiP, which allows for even easier use of our GaN devices,” said Primit Parikh, President and COO, Transphorm.


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