Tria introduces its first COM-HPC Mini form factor module
At Embedded World, Tria Technologies, an Avnet company, is launching the Tria™ HMM-RLP, the first of its modules featuring the COM-HPC Mini form factor.
Ideal for system designs that require outstanding performance and flexible IO connectivity in the smallest possible space, the COM-HPC Mini form factor module is based on the 13th Gen Intel® Core™ H-, P, or U-series processors. It offers high-end, scalable CPU computing performance in a small form factor. This allows system designers to choose from a variety of energy-efficient and performance options scaling up to fourteen cores and twenty threads at thermal design power ranging from 15 to 35 W. Additionally, the Intel Iris® Xe Graphics Engine, featuring up to 96 execution units, aids in accelerating graphics, media, and AI-intensive tasks.
“Embedded World will provide an opportunity for us to showcase how we enable customers to upgrade computational performance and functionality in system designs with restricted space and cooling,” said Daniel Denzler, Senior Director and business Line Manager at Tria Technologies. “That’s what makes this particular board ideal for mission-critical equipment that has to operate 24/7, even under extreme environmental conditions. This considerably broadens our product portfolio to support key markets in automation, robotics, medical, and transportation,” Denzler added.
Equipped with soldered memory of up to 64GB, in-band ECC data protection, and optional local NVMe, the module underlines its capabilities in demanding applications.
The board features a great variety of high-speed IO, including PCI Express® Gen 4, USB4, USB3.2, USB2.0, dual Gb Ethernet, MIPI-CSI, SATA, and serial ports. Multiple display options allow connecting up to four external displays via DDI, eDP, and USB4 interfaces, carrying four independent display streams.
Tria ensures the long-term availability of the product, which is designed and manufactured in Germany. Further investment protection is provided with 100% compliance with the COM-HPC open industry standard.
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