In this platform, TSMC offers multiple processes to provide significant power reduction benefits for IoT and wearable products and a comprehensive design ecosystem to accelerate time-to-market for customers.
In January, TSMC and MediaTek achieved their first product milestone on this platform by launching MediaTek’s MT2523 chipset for fitness smart watches. Built on TSMC’s 55nm ULP technology, MT2523 claims to be the first system-in-package (SiP) product to offer GPS, dual-mode Bluetooth Low Energy, and a MIPI-supported high-resolution mobile screen.
“We are pleased to continue the success of MT2523 and collaborate with TSMC in developing market leading IoT/wearable products using ULP technologies,” said JC Hsu, MediaTek’s Corporate Vice President and General Manager of IoT business unit.
“TSMC’s offerings of 55-nanometer ultra-low power (55ULP), 40ULP, 28HPC+, and 16FFC are ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets,” said Dr. BJ Woo, TSMC’s Vice President, Business Development.