TSMC grabs land for another back-end packaging fab

TSMC grabs land for another back-end packaging fab

Business news |
By Peter Clarke

Leading chip foundry TSMC is planning to spend NT$90 billion (about US$2.9 billion) on an advanced packaging facility in Tongluo Science Park, Miaoli County, Taiwan.

This will be TSMC’s second chiplet-oriented packaging unit in the county. The company has just opened its Advanced Backend Fab 6 – a major packaging and testing fab to realize chiplet and multi-die component assembly – in Zhunan Science Park, Miaoli County (see TSMC’s biggest chiplet backend fab opens for business).

Despite the opening of the facility at Zhunan Science Park, TSMC’s supply of InFO and CoWoS packaging for chips was described by CEO CC Wei as tight. This is being driven by demand for AI components with TSMC clients such as Nvidia and AMD competing for capacity.

The management authority for the Tongluo Science Park has issued an approval of the leasehold application for land by TSMC, according to Taiwan’s Central News Agency.

At present, the management authority has officially issued a letter to approve the land lease application of TSMC, and arranged a land lease briefing.

It therefore could be 18 months or more before the packaging facility built and manufacturing equipment installed.

Related links and articles:

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Singapore opens US$2bn chiplet factory

3D packaging drives US$11.9 billion capex

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Chiplet-savvy TSMC to build $10 billion assembly and test plant

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