TSMC grabs land for another back-end packaging fab
Leading chip foundry TSMC is planning to spend NT$90 billion (about US$2.9 billion) on an advanced packaging facility in Tongluo Science Park, Miaoli County, Taiwan.
This will be TSMC’s second chiplet-oriented packaging unit in the county. The company has just opened its Advanced Backend Fab 6 – a major packaging and testing fab to realize chiplet and multi-die component assembly – in Zhunan Science Park, Miaoli County (see TSMC’s biggest chiplet backend fab opens for business).
Despite the opening of the facility at Zhunan Science Park, TSMC’s supply of InFO and CoWoS packaging for chips was described by CEO CC Wei as tight. This is being driven by demand for AI components with TSMC clients such as Nvidia and AMD competing for capacity.
The management authority for the Tongluo Science Park has issued an approval of the leasehold application for land by TSMC, according to Taiwan’s Central News Agency.
At present, the management authority has officially issued a letter to approve the land lease application of TSMC, and arranged a land lease briefing.
It therefore could be 18 months or more before the packaging facility built and manufacturing equipment installed.
Related links and articles:
News articles:
TSMC’s biggest chiplet backend fab opens for business
Hua Hong plans to raise US$3 billion via Shanghai listing
Singapore opens US$2bn chiplet factory
3D packaging drives US$11.9 billion capex
Samsung improves interposer-based packaging
Chiplet-savvy TSMC to build $10 billion assembly and test plant
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
