TSMC heads south for next 7nm wafer fab location
The plant is expected to add volume at the 7nm and 6nm nodes and is TSMC’s first facility in Kaohsiung. TSMC has wafer fabs in Hsinchu, Tainan and Taichung. Kaohsiung is the headquarters location of packaging company ASE Technology and the wafer fab is expected to address Intel’s need for capacity as it outsources some of its requirements.
Construction is expected to start in 2022 with wafer production beginning in 2023 or 2024.
As part of the three-year capital expenditure program TSMC has obtained permission to build a wafer fab for 2nm production in Hsinchu. It also has plans for a mega-fab complex in Arizona (see TSMC plans six wafer fabs in Arizona) and chipmaking plant in Japan.
The move is part of TSMC’s largest-ever expansion push, which includes spending $100 billion over the three years through 2023 to enlarge production capacity at home and abroad. The chip titan also recently received final regulatory approval to build its most advanced chip plant yet in the Taiwanese city of Hsinchu. In addition, it is finalizing discussions for its first chipmaking plant in Japan.
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