TSMC in wafer fab talks with German government
Lora Ho, senior vice president responsible for sales, told reporters on the sidelines of a technology forum in Taipei that talks had begun with the German government but that a final decision would depend on government subsidies, customer demand and the talent pool. The Taiwanese chipmaker has yet to discuss incentives with German authorities, or decide upon a location, according to Ho.
In July TSMC chairman Mark Liu said TSMC was in discussions with customers over setting up a wafer fab in Germany. A move into Germany and Japan are a transition from a policy to focus the majority of its production on a few sites in Taiwan. TSMC has built fabs in the US (Wafertech) and in China in the past. And it has now committed to building a major chip facility in Arizona.
- TSMC confirms German fab talks
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TSMC has started to extend its manufacturing footprint in response to various major countries seeking to increase domestic semiconductor production out of national security and self-sufficiency concerns. However, the cost of production is likely to be considerably more in Europe than in Asia and so TSMC will be seeking a high-level of financial support.
Chipmaker and would-be foundry Intel is expected to announce location for a wafer fab in Europe – either in Bavaria, Germany, or Galway, Ireland – before the end of the year.
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