TSMC opens global R&D centre for 1nm push
TSMC has opened its global Research and Development Center in Hsinchu, Taiwan, that will drive the next generations of semiconductor technology.
The centre will house 7000 researchers working on 1nm process technologies and below as well as scientists working on novel materials and transistor structures. It will be ready for its full complement of more than 7,000 staff by September 2023.
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“The brilliant minds that we will gather together here at our global R&D Center will be working to answer today’s most challenging questions in semiconductor technology, as well as future questions that we have not even imagined,” said TSMC Chairman Dr. Mark Liu. “I am eagerly looking forward to seeing the solutions and technologies that will emerge from here in the decades to come.”
TSMC Founder Dr. Morris Chang, Chairman Dr. Mark Liu, and CEO Dr. CC Wei presided over the inauguration ceremony, which brought together guests from customers, R&D partners, universities, design ecosystem partners, industry associations, and senior government officials including Premier Chen Chien-Jen, National Science and Technology Council Minister Wu Tsung-Tsong, Minister of Economic Affairs Wang Mei-Hua, and Hsinchu County Magistrate Yang Wen-Ke. In total, more than 200 attendees joined the event.
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“As we celebrate this milestone for TSMC R&D, I would like to thank our customers for their trust in us to deliver the right technology at the right time for them,” said Wei. “I would also like to thank our R&D team for making that possible. Your tireless curiosity and courage in accepting challenges enables TSMC to drive technology forward and help customers bring groundbreaking innovations to life.”
The centre is 300,000 square meters and has rooftop solar panels capable of generating 287 kilowatts at peak conditions.
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