TSMC plans automotive chiplet process for 2025
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TSMC is planning automotive qualified versions of its 3D fabric chiplet technology by the end of 2025.
The InFO-oS fanout technology will support multiple SoC devices on a substrate, with the first automotive chiplet process design kit (PDK) towards the end of this year and the full PDK early in 2026.
The CoWoS-R process will support SOCs with high performance HBM memory via an interposer to the substrate. The initial PDK will be available shortly with the full PDK similarly early in 2026.
The processes will be AEC Q100 Grade2 qualified by Q4’25 said TSMC at its European technology symposium yesterday.
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The CoWoS platform includes the most mature Si interposer-based CoWoS-S and the organic interposer-based CoWoS-L and R. The automotive processes build on the experience with over 150 CoWoS customer product tapeouts for more than 25 customers by the end of this year.
Automotive is also key for the ESMC joint venture fab which will start construction later this year with and volume production in 2027. ESMC is a strategic collaboration and commitment of Bosch, Infineon, NXP, and TSMC to support European customers with N28 and N16 process technologies
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