TSMC teams with Nvidia, Broadcom on silicon photonics
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TSMC has formed a silicon photonics R&D team of 200 engineers to work with Nvidia Corp. and Broadcom to target AI in the datacentre, according to an Economic Daily News report.
AI communications in the datacenter are a source of extreme power consumption that could ultimately block further development of the technology. The use of optical transmission could serve to reduce latency and power consumption.
Much of the research will be on the optimization of the co-packaging of silicon photonic optical components with silicon ASICs in highly integrated modules.
The report said that TSMC is working with major customers including Broadcom and Nvidia to develop silicon photonics and co-packaged optical components with technologies spanning 45nm to 7nm. This could produce orders in 2024 and mass production in 2025, the report said.
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