TSMC tips second Japan wafer fab as Toyota joins team
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The wafer fab joint venture between TSMC, Sony and Denso in Kumamoto prefecture known as JASM (Japan Advanced Semiconductor Manufacturing) has recruted Toyota and announced plans to build a second fab.
Toyota has agreed to join the established trio in building a wafer fab starting in 2024 and scheduled to begin operation by the end of the 2027 calendar year. Together with JASM’s first fab, which is scheduled to begin operation in 2024, the overall investment in JASM will exceed US$20 billion with strong support from the Japanese government.
The increased production scale is also expected to improve overall cost structure and supply chain efficiency for JASM. With both fabs, JASM’s Kumamoto site is expected to offer a total production capacity of more than 100,000 300mm-diameter wafers per month using 40, 22/28, 12/16 and 6/7nm process technologies for automotive, industrial, consumer and HPC-related applications. Across both fabs, the Kumamoto site is expected to directly create more than 3,400 high-tech professional jobs.
TSMC, Sony, Denso and Toyota will hold equity stakes of approximately 86.5, 6.0, 5.5 and 2.0 percent in JASM, respectively. The closing of the transaction among JASM, TSMC, Sony, Denso and Toyota is subject to customary closing conditions.
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Japan to break into advanced chip manufacturing, says TrendForce
Denso joins TSMC’s Japanese wafer fab club
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