TSMC, the world’s leading foundry, is planning to make chips using its 3nm manufacturing process at its wafer fab complex in the US state of Arizona, according to a Reuters report quoting company founder and former chairman Morris Chang.
When TSMC first announced it was going to build a wafer fab in Arizona back in 2020 it said that fab was earmarked to make 5nm chips initially, but made no commitment to go further (see TSMC picks Arizona for 5nm wafer fab).
Chang is no longer employed by TSMC but is still influential in the company and within the semiconductor industry. He disclosed TSMC’s plans during a press conference in Taipei on his return from Bangkok where he had been representing Taiwan at an Asia-Pacific Economic Co-operation (APEC) summit.
It was already known that TSMC had a long-term roadmap for the Arizona campus that could accommodate up to six fab modules (see Reports: TSMC planning for six wafer fabs in Arizona).
“Three-nanometer, TSMC right now has a plan, but it has not been completely finalised,” Reuters reported Chang saying to reporters. “It has almost been finalised – in the same Arizona site, phase two. Five-nanometre is phase one, 3-nanometre is phase two,” Chang said.
Related links and articles: