TSMC, Trump announce an extra US$100 billion capex in the US
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Foundry TSMC has announced that it will spend an additional US$100 billion in semiconductor manufacturing in the US. This is on top of US$65 billion already committed to building wafer fabs in Phoenix, Arizona.
CC Wei, the chairman and CEO of TSMC (Hsinchu, Taiwan), went to the White House to make the announcement on Monday March 3, standing alongside President Donald Trump.
This was immediately before the US administration imposed tariffs of 25 percent on imports from Mexico and Canada and an extra 10 percent tariff on imports from China taking the rate there to 20 percent. Taiwan, was not included in the latest tariff regime.
TSMC said the US$100 billion would be used to build three wafer fabs, two advanced packaging facilities and a major R&D center. This is the largest single foreign direct investment in US history but locations were announced for the expenditure.
The spend is expected to create 40,000 construction jobs over the next four years and tens of thousands of electronic and semiconductor engineering jobs over the next decade, TSMC said.
The plan is expected to support US leadership in AI by providing US manufactured chips to such customers as Apple, Nvidia, AMD, Broadcom, and Qualcomm.
“With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our US semiconductor manufacturing investment by an additional $100 billion, bringing our total planned investment to $165 billion,” said Wei in a statement.
The announcement also comes almost immediately after Intel announced a delay in its plans to build up manufacturing capacity in the US.
It also follows a bold announcement of US spending by Apple, a close customer of TSMC.
TSMC has a wafer fab operating in Phoenix that currently employs 3,000 people and which has been in volume production since late 2024 with plans for a second fab at that location.
TSMC also has a mature wafer fab in Camas, Washington.
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