Tuning 3-D tools for volume production
The research consortium’s 3-D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3-D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues.
3-D integration is introducing several new process steps primarily on the wafer backside and between chip makers fab processes and packaging. Compared to existing fab tools, these new processes and the accompanying tools are relatively immature and need a comprehensive understanding of tool performances to prepare for high volume manufacturing (HVM), according to Sematech.
“3-D is a major industry transition,” said Sitaram Arkalgud, director of Sematech’s 3D Interconnect program.
“The EMA aims to ensure that enough information is collected to make a sound judgment about the amount of testing to which equipment should be subjected during demonstration testing,” said Sanjay Rajguru, director of ISMI, a global alliance of the world’s major semiconductor manufacturers, dedicated to reducing cost per wafer and ultimately cost per die, through cooperative programs focused on manufacturing effectiveness. ISMI is a wholly-owned subsidiary of Sematech.
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