DustPhotonics in Israel has teamed up with MaxLinear on a silicon photonics chipset with integrated lasers that is directly driven from a DSP without the use of any external driver chips.
DustPhotonics has developed an integrated DFB (Distributed-feedback) laser and Low Loss Laser Coupling technology (L3C), achieving a very efficient coupling of light into the Photonic Integrated Circuit (PIC) using standard silicon process technology.
This enables the use of one laser for every four channels and has been implemented in a Silicon Photonics chip called Carmel. This links directly to the MaxLinear 5nm Keystone DSP (Digital Signal Processor) for direct-drive 400Gb/s and 800Gb/s pluggable modules and on-board optics for high speed communication links in data centres.
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The MaxLinear Keystone chip is part of a family of DSPs capable of both 400Gb/s and 800Gb/s operation with integrated drivers built on TSMC’s 5nm process. In terms of power consumption, 400Gb/s transceivers can now be designed to reach sub 7W.
“DustPhotonics is focused on enabling best-in-class Silicon Photonics chips to simplify the efforts of transceiver and systems designers,” said Yoel Chetrit, Vice President R&D of DustPhotonics. “Not only can our Carmel chip simplify the overall system design by reducing the total number of lasers to a single laser for four channels, but it also eliminates the external driver, which reduces the cost, power and complexity of the overall system.”
“The combination of our Keystone 5nm integrated driver DSPs with DustPhotonics’ silicon photonics demonstrates the significant power and performance advantages achievable with our integrated drivers,” said Drew Guckenberger, Vice President of Optical Interconnect at MaxLinear. “With double-digit year-on-year growth in market demand for 400Gb/s and 800Gb/s transceivers, this integrated solution can create tremendous value for our customers. We look forward to seeing full transceiver deployments in the near future.”
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