Two team for packaging lithography

Two team for packaging lithography

Business news |
Kulicke and Soffa Industries is working with i3 Microsystems on next generation lithography systems for advanced chip packaging technology.
By Nick Flaherty

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Kulicke & Soffa’s high-speed and high- accuracy LITEQ 500A 355nm laser-powered projection stepper was recently adopted to expand capabilities and capacity within i3 Microsystems’s advanced microelectronics packaging facility.

With a numerical aperture of 0.128, the LITEQ 500A can expose ultra-fine pitch patterns with a 16µm depth of focus. The customisable design can compensate for high-warpage wafer handling, die-shift or rotation correction on reconstructed wafers, multi-product reticle masking and contact-free wafer-edge protection. This makes it suitable for MEMS, optical, radio-frequency (RF) and advanced logic packaging.

i3 Microsystems provides design support and full fabrication of fan-out wafer level packaging (FO-WLP), heterogeneous system in a package (HSIP), and flip chip and surface mount (SMT) assembly within a pure-play, trusted foundry. 

The programme is based on work for the US Department of Defense (DOD), and the i3M Advanced Packaging Process Design Kit (AP-PDK) offers government, industry, and academic partners access to this packaging technology.

“K&S’s LITEQ 500A projection stepper at the i3 Microsystems foundry will add additional capability and capacity, and support wafer sizes from 100mm to 300mm with improved resolution, faster throughput, and broad compatibility for digital and radio-frequency advanced packaging applications,” said Justin Borski, i3 Microsystems’s Director of Business Development & Programs. “This expansion of capability and capacity reflects i3 Microsystems’s commitment to serve as a solution provider for protecting our national security with secure domestic prototyping and manufacturing; accelerating innovation with state-of-the-art technologies; and strengthening our domestic semiconductor supply chain and ecosystem through collaboration.”

“We are honoured to partner and collaborate with i3 Microsystems, a leading manufacturer of advanced, reliable high-performance electronic and integrated systems solutions. Through this collaboration, leveraging on i3 Microsystem’s leading  technology together with the LITEQ 500A, we are positioned to deliver a revolutionary suite of advanced microelectronics packaging solutions for our customers and the industry”, said Joeri Durinckx, Kulicke & Soffa’s VP  of the EA/APMR and Lithography Business Unit.

www.kns.com; www.i3microsystems.com;

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