UCIe sees automotive chiplet group with latest specification
The UCIe Consortium has launched an automotive chiplet group alongside the public release of Universal Chiplet Interconnect Express specification version 1.1 specification.
Version 1.1 of the UCIe chiplet specification extends the reliability mechanisms to more protocols and supporting broader usage with predictive failure analysis and health monitoring and lower-cost packaging implementations. The specification also details architectural specification attributes to define system setups and registers that will be used in test plans and compliance testing to ensure device interoperability.
Demand from the automotive industry for chiplets built around UCIe technology led to the Automotive Working Group, which has already started working on the development of protocol enhancements for runtime health monitoring and repair.
“ARM partners are already delivering chiplet-based solutions in infrastructure applications; in automotive, chiplets can reduce time to market, allow for new performance points and enable unique SoC designs in applications such as ADAS and infotainment, while still delivering the dedicated features tailored to the safety and real-time needs of the market,” said Andy Rose, VP Technology Strategy and Fellow at ARM.
“ARM will continue to work with industry leaders in the UCIe Consortium on standards and specifications like the UCIe 1.1 Specification as the Consortium expand to increase interoperability and address industry needs.”
“The formation of the Automotive Working Group and the incorporation of automotive-specific requirements UCIe 1.1’s ECNs showcase the industry’s commitment to advancing chiplet technology for automotive applications, promising enhanced performance and adaptability in multi-die systems for our vehicles. I look forward to the continued collaboration with UCIe in driving innovation and efficiency in the automotive semiconductor ecosystem,” said Jongsun Kim, VP, Semiconductor Development Group, IATD for Hyundai Motor Group.
In the meantime the UCIe 1.1 Specification is fully backward compatible with the UCIe 1.0 Specification and includes support for streaming protocols with full UCIe stack, including simultaneous multiprotocol support with end-to-end link layer functionality.
“The UCIe 1.1 Specification was developed by leaders in the industry to advance the chiplet ecosystem and address significant demand for full stack streaming protocol enhancements,” said Dr Debendra Das Sharma, chairman of the UCIe Consortium.
“It’s thrilling to witness the introduction of new features, like automotive enhancement and full-stack streaming protocol, in UCIe 1.1. These enhancements are expected to further broaden the applications of UCIe and fuel the rapid growth of the chiplet ecosystem. Alibaba Cloud is proud to be part of this journey,” said Dr. Jian Chen, Chief Architect of Cloud Server Infrastructure, Alibaba Cloud.
“UCIe has gained industry-wide attention and highlighted the tremendous interest in an open chiplet economy. The UCIe 1.1 Specification includes many important clarifications and improvements, bringing the industry closer to this goal. As the chiplet landscape progresses, Blue Cheetah will continue to enable customers to adopt the chiplet paradigm through its customized die-to-die interface solutions, including support for UCIe,” said Elad Alon, CEO of Blue Cheetah Analog Design.
“Socionext strives to provide optimum silicon solutions to customers who seek innovations in the global marketplace. As Moore’s law slows down, the industry is facing new challenges that include enhancing data traffic in high-performance computing, balancing requirements for computing performance and footprint, as well as heterogeneous integration of high-speed I/O and high-speed computing devices,” said Hisato Yoshida, Corporate Executive Vice President and Head of Global Business Development at chip designer Socionext.
“The UCIe standard plays a key role in addressing these challenges. In particular, the UCIe 1.1 Specification has enhanced features for functional safety, and we expect its adoption will be accelerated in the automotive domain, one of our primary focus areas,” he added.
The cost optimization for advanced packaging comes from new bump maps, while there are enhancements for compliance testing.
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