UK semiconductor design house EnSilica raises £6m from IPO
UK semiconductor design house EnSilica in Oxford, UK, is raising £6m ($7.4m, €7m) for expansion.
The company is listing its shares for the first time on the London Stock Exchange’s AIM market for market for small and medium sized growth companies, and expects to begin trading next week. The initial public offering (IPO) values the company at £37m ($46m).
The company designs ASICs for system developers working across the automotive, satellite and healthcare sectors.
- EnSilica opens design centre in Sheffield
- ASIC win for cellular satellite broadband network
- Scalable, asymmetric multicore processor IP for low power
- Low power wireless sensor targets medical designs
“Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives, which will ultimately further expand both market reach and customer footprint,” said CEO Ian Lankshear.
“Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets,” he said.
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