The technology displays detailed shapes of machined surfaces down to a resolution of 1µm in a 3D machining simulation, which machine operators can use to evaluate surface textures without trial cutting through a high quality machining process and allows checks for possible over- or under-processing marks or scratches.
In recent years, the mold processing sector has pursued ways to reduce time by using high-precision, high-quality machining methods that do not require polishing. Further, direct processing is being used increasingly instead of die-mold production, which has raised the demand for high-quality finishing by cutting.
Cutting devices are controlled by machining programs generated by computer-aided design (CAD) and computer-aided manufacturing (CAM) programs. Actual machining tests are normally done to verify the integrity of machining programs. This requires a lengthy process of repeated trial cutting to confirm that high-precision and high-quality machining results are achieved.
Mitsubishi Electric’s new technology enables high-precision, high-definition finishing by simulating 3D machining, which leads to more efficient production by permitting operators to evaluate surface texture outcomes, as well as by eliminating the need for tests of actual high-grade machining.
Complex shapes are displayed with limited data using Mitsubishi’s unique Multi-ADF (adaptive distance field) shape-representation technology and Mitsubishi has improved the run time by reducing the data storage requirement to 50MB, two orders of magnitude less than conventional high-resolution 3D simulations.
The 3D representation of multi-ADF proprietary technology uses less than 1% of the storage capacity required by conventional, high-resolution geometric model resolutions at the 1 micron level. Multi-ADF represents 3D shapes with a set of tiny cubes each with refined descriptions of multiple surfaces on them. This technology makes it possible to display dents and scratches on machined surfaces down to a resolution of one micrometer using fewer cubes, allowing high-speed simulations that require little memory.