Ultra-low power Bluetooth IC for multi-stream audio

Ultra-low power Bluetooth IC for multi-stream audio

New Products |
By Jean-Pierre Joosting

NXP® Semiconductors has announced the NXH3675 high-quality audio streaming IC, a highly integrated, single-chip 2.4 GHz transceiver that is certified to the Bluetooth® 5.3 LE audio standard. The device enables developers to create innovative products in the Bluetooth audio world with features like high-quality audio transmission, broadcasting capabilities, and multiple audio streams and data channels. With an optimized audio streaming protocol from NXP, the device delivers ultra-low latency with ultra-low power consumption for advanced use cases. Target applications include gaming headsets, hearing aids, soundbars and TV transmitters, and wireless headphones, earbuds, speakers, and microphones.

Millions of consumers already use Bluetooth audio devices in everyday life, from earbuds to hearing aids and other hearable devices. According to recent market reports, 1.3 billion Bluetooth audio streaming devices were shipped in 2021, with a forecast of 1.5 billion for 2023. For these applications, the Bluetooth LE audio standard takes audio quality to the next level and brings a new way of experiencing audio. The new standard enables audio sharing, hearing assistance, and new use cases that we could not even imagine having with classic Bluetooth audio. NXP has long been at the forefront of Bluetooth audio technology and is currently one of the key players in the most recent Bluetooth 5.3 LE audio standardization.

“The new Bluetooth LE audio standard is set to revolutionize the wireless listening and hearing experience. This requires wireless transceivers with advanced audio processing capabilities that are power efficient with ultra-low latency,” said Karolien De Baere, Product Marketing and Business Development, NXP. “The NXH3675 is fully compliant with the new Bluetooth LE audio standard, supporting multiple streams, while having exceptional low power consumption and ultra-low latency.”

Key features include:

  1. Bluetooth 5.3 LE audio certified with Auracast™, a broadcast audio communication, which enables creative audio sharing use cases, in the 2.4 GHz radio band.
  2. A dedicated Arm® Cortex®-M0+ for supporting full flexible software link-layer protocol up to the HCI level, enabling multi-stream applications.
  3. A dual CoolFlux® DSP for audio processing of the LC3 and LC3+ audio encoder/decoder and audio and voice enhancements such as EQ, compression, gain control and mixing.
  4. Improved battery life – exceptionally low power consumption.
  5. Includes an optimized NXP protocol for ultra-low latency.

To simplify development and reduce time-to-market, NXP offers the NXH3675 starter kit, which includes an evaluation kit for debug and evaluation purposes, gaming headset and dongle application kits, and a software development kit. The NXH3675 Bluetooth audio IC is sampling now.


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