Ultra-low-power Wi-Fi/Bluetooth/802.15.4 combo SoCs
Synaptics® Incorporated has expanded its award-winning Veros™ Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi® 2.4/5/6 GHz, Bluetooth® 6.0, Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee®/Thread®) systems on chip (SoCs).
Ideal for embedded Edge AI IoT applications, the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering outstanding rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer Bluetooth features, such as Channel Sounding and LE Audio, including Auracast™. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.
The SoCs provide reliable connectivity of up to 50 Mbps while enhancing battery life and maximising range. The integrated Tx/Rx switch, LNAs, and PAs reduce area BOM and system costs while simplifying design by only requiring a direct antenna connection. A low-pin-count WLBGA package option is available for low-cost, plated-through-hole (PTH) PCBs, resulting in a 25% reduction in typical board cost. An integrated processor offloads the host application processor to minimise system power consumption, while Secure Boot helps to ensure system integrity.
Launched in 2024, Veros Seamless Intelligent Connectivity encapsulates decades of field-tested technology and IoT connectivity expertise. It encompasses Synaptics’ entire wireless portfolio of proven technology, which is characterised by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra™, the AI-native compute platform for the IoT.
“The SYN461x family is a breakthrough addition to our Veros portfolio,” stated Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP-embedded Edge AI IoT applications. We believe that their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.
“The degree of versatility required to meet the unique connectivity needs of the diaspora of diverse low-power IoT applications demands a high degree of domain expertise,” said Phil Solis, Research Director at IDC. “Ultra-low-power and highly flexible solutions such as the SYN461x make a solid case for discrete, targeted, wireless SoCs in markets where more options are needed.”
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